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Registered Member #1062
Joined: Tue Oct 16 2007, 02:01AM
Location:
Posts: 1529
I recently started soldering SMD parts with hot air after getting tired of doing 0402 with an iron. What temperature should I use? I can't seem to get it to melt unless I pass 390 degrees. That sounds normal enough, but after I solder it, the entire board is hot (45mm square). Perhaps this is because it is a 6 layer PCB, with two nearly full copper planes (gnd and power). I am also concerned about the chip getting too hot and burning. I need to solder a 14mm square TQFP with a ground pad (and none of my nozzles are big enough, so I will be moving a 10mm square one) and want to make sure the processor won't die.
Should I use solder paste directly out of the fridge? I read somewhere to take it out 18-24hr before soldering, but the paste seems a bit runny and components don't really stick to it. I had to lower the air flow all the way to prevent the components from blowing off.
Registered Member #162
Joined: Mon Feb 13 2006, 10:25AM
Location: United Kingdom
Posts: 3140
Our hot air gun at work comes with a selection of metal shields for this purpose, Or you could use polyamide tape to shield the surrounding areas, I got mine for a couple of quid from China via eBay.
Registered Member #1451
Joined: Wed Apr 23 2008, 03:48AM
Location: Boulder, Co
Posts: 661
You might want to let the paste warm a bit. Our paste melts very quickly at around 300 degrees. The paste starting out cold might affect the total heating time slightly.
The TQFP will probably be fine; the air is 390 degrees but the parts doesn't necessarily get up to that temp. All those chips are designed to withstand the heat it takes to melt the solder.
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Hot air Soldering
