GBD wrote ...
Ive been having some issues with these very small ICs in SMD package.
To make things worse, this IC has a powerpad on the buttom that needs to be soldered for heat dissapation. (its a boost IC)
I was thinking to use solder powder and a heat source to allow it to melt and adhere (without actual contact of the heat source), as I see soldering this thing with an iron nothing short of a pain in the ass.
Does this idea sound feasable? or does anyone else have any methods for tiny things like this?
Also, other then the solder powder method, how would one go about soldering the buttom heat pad without killing the IC from over temperture?