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Registered Member #191
Joined: Fri Feb 17 2006, 02:01AM
Location: Esbjerg Denmark
Posts: 720
If you are running a dual layer board with thruhole, you can put a bunch of via under the powerpad and solder it from the back side. I've done BGA that way as well.
Registered Member #3040
Joined: Tue Jul 27 2010, 03:15PM
Location: South of London. UK
Posts: 237
GBD wrote ...
You might want a bit more clearance between the ground-plane under the chip and the pads for the pins. Solder bridges between adjacent pins are easy to deal with but solder bridges between a pad and the ground-plane under the chip can be a bitch to clear. For the same reason don't overdo the amount of paste you put under the thermal pad, remember it will spread out when you place the chip.
Registered Member #191
Joined: Fri Feb 17 2006, 02:01AM
Location: Esbjerg Denmark
Posts: 720
Martin King wrote ...
GBD wrote ...
You might want a bit more clearance between the ground-plane under the chip and the pads for the pins. Solder bridges between adjacent pins are easy to deal with but solder bridges between a pad and the ground-plane under the chip can be a bitch to clear. For the same reason don't overdo the amount of paste you put under the thermal pad, remember it will spread out when you place the chip.
Agreed, and proper masking is required, especially around the power pad, to prevent the solder from pooling to one corner. Look at the datasheet for references.
Registered Member #162
Joined: Mon Feb 13 2006, 10:25AM
Location: United Kingdom
Posts: 3140
For hobby prototyping SOP and SSOP (1mm and 0.635mm pin spacing) I use these very good quality BUT no heatsink pad, (I epoxy (Araldite) the ic for better heat dissipation) Excellent price too. P.S. the photo doesn't do justice to the quality.
Registered Member #311
Joined: Sun Mar 12 2006, 08:28PM
Location:
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put some vias in the centre pad, and leave a pad-sized gap in the resist on the underside. Solder paste on the centre pad, place the part and tack a couple of pads. Apply an iron to the exposed pad on the underside & the paste will flow & solder the pad.
Registered Member #3040
Joined: Tue Jul 27 2010, 03:15PM
Location: South of London. UK
Posts: 237
Vias, resist etc.assume that he's getting the board made commercially (which maybe he is?). the "stick it in the oven" (TM) method will work with home made boards as long as the board is designed carefully. Solder pooling and bridges between pins are no big deal, just a simple rework job with an iron and some wick but you need to design the board to reduce the chances of solder bridges where you can't get at them.
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Soldering tiny SMD ICs?
